Research fields:

Packaging technologies

Alloy • IMC • Reflow • SMT • Soldering • Tin whisker • VPS

👤
Illés Balázs
full professor, head of department
V1.014
(+36) 1 463-2755
A kutatócsoport tagjai:
👤
Illés Balázs
full professor, head of department
👤
Krammer Olivér
associate professor
👤
Géczy Attila
associate professor
👤
Bátorfi Réka Erzsébet
assistant research fellow
👤
Gál László
honorary associate professor
👤
Illyefalvi-Vitéz Zsolt
honorary professor

Activity of the research group:

The main activities of the research group are the development of new types of composite and micro-alloyed solder materials, the optimisation of their soldering parameters and the investigation of their reliability (such as electrochemical migration, tin pest and whisker phenomena). Furthermore, research on degradable circuit substrates for wearable and degradable electronics.

Recent results:

Investigating the physical mechanisms of VPS ovens by measurement and numerical simulation of the vapour space and temperature distribution. Investigating the tin whisker phenomena in different material systems and under different environmental conditions.

Special infrastructure:

ASCON vacuum VPS

Recent projects:

MECA (Erasmus+) • METIS (Erasmus+) • OTKA

International relations:

CVUT • Lukasievicz Netwrok • University Sain Malaysia

Industrial partners:

Robert Bosch • MFA
👤