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Sustainable Electronics

Activities of the research team:

The research group is mainly concerned with the sustainability of applied electronic materials, substrates and packages and their substitution by novel materials. Our research, which started in 2010, aims at replacing electronic substrates with biodegradables, culminating in an M-ERA and an H2020 (Pathfinder EIC) call in 2023 and 2024. In addition, circular electronics, waste minimisation technologies are also targeted for research. Research is being conducted along the UN SDGs 9 and 12 (Sustainable Development Goals). The research team also aims to improve electronics manufacturing technology along SDG9 by optimising manufacturing processes to be energy efficient and minimise waste through research on waste minimisation. The strengths of the research group are that its staff have a strong electronics manufacturing technology foundation requiring interdisciplinary knowledge, and that decade of experience have focused globally unique knowledge in the group’s work. The results achieved by the research group will be used in the future to inform the practice of electronics manufacturing and waste processing along the lines of the Green Deal and EU sustainability objectives.

Results:

Starting from the initial PLA (polylactic acid) and CA (cellulose acetate) based substrates, the group has now developed, in collaboration with Meshlin Ltd, a novel, fire-retarded, fibre reinforced, biodegradable substrate technology compatible with currents subtractive circuit and surface mount technologies. As a result, the research team is involved in successful projects. The research has resulted in the world’s first working Arduino Nano circuit on this substrate. In terms of electronic waste potential, electronics made in this way can reduce waste by up to 70-90% by weight of previously difficult-to-process epoxy/glass fibre-based plastic components. High-frequency characterization of the materials, development of bioleaching-based copper recovery, and further application of circular recycled copper for electronics conductors are underway through international cooperation. We are also conducting composting (outdoor, laboratory) experiments, the results of which are continuously published.

Specialised infrastructure:

PCB production line – FEI Inspect S50 scanning electron microscope – SONIX HS1000 scanning acoustic microscope – Bruker Tensor II infrared spectroscope – Spectro Midex M X-ray fluorescence spectrometer – Dage XD6600 X-ray microscope – Espec and Weiss climate chambers – Coherent AVIA 355 laser micromachining – Epilog Mini 30W laser micromachining – Voltalab PGZ301 dynamic EIS and voltmeter – Agilent Miliohmmeter – outdoor and indoor composting units

Recent projects:

Horizon 2020 2024 | Pathfinder EIC | DESIRE4EU – DESIgning and REcycling sustainable Electronic boards for a EUropean circular economy
2023 M-ERA | Beatrice – Biobased dEgradable flAme reTardant pRInted eCo-Electronics

International links:

Arduino AB., University of Grenoble Alps (UGA, INP), Hochschule für Technik und Wirtschaft (HTW) Dresden, Czech Technical University of Prague (FEL CVUT), Sinano Association, Universite Catholique de Louvain (UCL), AB Chimie, Alba Elettronica

Corporate partners:

Meshlin Ltd. – basic research on fibre-reinforced biodegradable substrates

UniPCB Ltd. – research on the application of fibre-reinforced biodegradable carriers

Arduino AB. – research into sustainable embedded electronics

Solid-state lighting systems

Activity of the research group:

Multi-domain (combined electrical, optical and thermal) measurement, modelling and simulation of LED luminaires, OLED devices, CoB LEDs, including LED ageing studies. Research for Lighting 4.0.

Recent results:

Together with members of the Delphi4LED consortium led by Signify, we have developed an Industry 4.0-like workflow for the fully computerised design of LED luminaires, essentially eliminating the need for physical prototyping of luminaires. The workflow is based on multi-domain digital twins of LEDs and LED modules, which are used to create virtual prototypes of LED luminaires for a given application scenario. Using these, computer simulations can be used to define the key operating parameters, eliminating the need for physical prototyping of the luminaires.

• The digital twins of LEDs (or more precisely LED packages) are based on the so-called wafer-level multi-domain LED model developed by us. This model has been further developed in several steps.
• We have developed a method to develop a system-level model of LED luminaires.
• We have developed a method for a constant total luminous flux control scheme for LED luminaires. This can save up to 3-5% of the electricity consumed by street lighting.
• We have developed a new theory to describe the aging process of LEDs using standard LM-80 measurements.
• A theoretical model for constant luminous flux control compensating for both temperature variation and ageing effects has been developed. Nearly 14% of the electricity consumed during the lifetime of the L90 can be saved and the lifetime can be extended by nearly 30%.
• We have developed a multi-domain model of an LED type describing ageing. With such a model, Industry 4.0 design work can be significantly accelerated and the resources required can be greatly reduced.
• Complex in-situ test methods have been developed to determine the operational performance parameters of LEDs. The method can be used to detect, among other things, problems resulting from faulty thermal design.

Special infrastructure:

T3Ster testers and accessories • TeraLED equipments • Instrument Systems CAS 140 spectroradiometer • Ocean Optics H2000+ spectroradiometer • LED ageing chamber • WEISS climate chamber • Julabo thermostat

Recent projects:

AI-TWILIGHT H2020 ECSEL • Delphi4LED H2020 ECSEL • NKFIH K 128315 – New test methods for LED ageing

International relations:

ITRI Taiwan • NIST USA • Photometric Solutions / CIE Div2 • Instrument Systems / CIE Div2 • Signify • PI-Lighting • TU Eindhoven

Industrial partners:

Osram OptoSemi • HungaroLux Light Kft • GE Lighting Hungary

Photovoltaic systems, nano- and microelectronics

Activity of the research group:

Physics and technology of semiconductors, implementation, modelling and metrology of semiconductor-based electronic devices, including solar cells, sensors, thermal electrical active devices. Modelling of solar cells and modules, integrated cooling of concentrator solar cells, testing of Si-perovskite tandem solar cell structures.

Recent results:

• Thermal electric circuits, implemented
• System for solar panel production forecasting using multi-domain models (measuring station on top of building D for data collection), based on ready meteorological data.
• Perovskite solar cells: long-term behaviour, stability and temperature tests. Results expected in the short term.
• Multi-domain digital twins for solar cells (industry/PV 4.0 connection)

Special infrastructure:

Clean room laboratory (Class 6, double-sided lithography, high purity heat treatment up to 1350 °C, rapid heat treatment, chemical machining station, etc. ) + outdoor wafer cutting, implantation, wire bonding • Layer deposition equipment (cathodic sputtering, vacuum evaporation) • Electron microscope/electron beam lithography • Semiconductor technology qualification measurement equipment • Emission microscope • Resonant capacitor potential/surface photovoltage mapping • Solar cell measurement (solar simulator, electrical measurement equipment)

Recent projects:

NKFI/OTKA projects

International relations:

University of Oulu • Technische Hochschule Ulm • TU Tallin

Industrial partners:

Semilab Zrt

Nanotechnology, sensors

Activity of the research group:

Traditionally the main focus of the research group is on the research and development of electrochemical and optical biosensors and microfluidic systems. In the past few years, this is shifted towards optical, mainly plasmonic biosensors, that require the development of nanomaterial (nanocomposite) based sensor elements. Concerning sample handling, the focus is on polymer-based microfluidic systems.

Recent results:

In the framework of an international collaboration with CEITEC, Brno, we developed a novel gold nanoparticle – epoxy surface nanocomposite, that was successfully applied as a localized surface plasmon resonance (LSPR) sensor element as a label-free nucleotide sensors. The nanocomposite was also tested as a SERS substrate (in collaboration with Wigner FK, Hungary). In one of the ongoing projects, it is currently applied for COVID-RNA detection with Raman-spectroscopy.

Special infrastructure:

Veeco diInnova atomic force microscope • Surface plasmon resonance imaging device • Avantes Avaspec 2048-4DT spectrophotometer, with 3 light sources (UV, VIS, NIR) + Avantes IR spectrometer and light source • Voltalab PGZ 301 és Voltalab PST50 potentiostats • Objet Eden 250 Inkjet Polyjet 3D printer • Diener Pico low pressure plasma chamber • Polimer workstation (spin coater, vacuum chanber, laminar box, etc.)

Recent projects:

DAAD German-Hungarian bilateral project • FIKP

International relations:

Brno University of Technology • University of Bologna • Teesside University

Industrial partners:

77 Elektronika Kft. • Femtonics Kft. • Shopguard Kft. • Oncotherm Kft

Packaging technologies

Activity of the research group:

The main activities of the research group are the development of new types of composite and micro-alloyed solder materials, the optimisation of their soldering parameters and the investigation of their reliability (such as electrochemical migration, tin pest and whisker phenomena). Furthermore, research on degradable circuit substrates for wearable and degradable electronics.

Recent results:

Investigating the physical mechanisms of VPS ovens by measurement and numerical simulation of the vapour space and temperature distribution. Investigating the tin whisker phenomena in different material systems and under different environmental conditions.

Special infrastructure:

ASCON vacuum VPS

Recent projects:

MECA (Erasmus+) • METIS (Erasmus+) • OTKA

International relations:

CVUT • Lukasievicz Netwrok • University Sain Malaysia

Industrial partners:

Robert Bosch • MFA

Thermal management, electronics cooling and reliability

Activity of the research group:

Measurement, modelling and simulation of the thermal properties of semiconductor devices, modules and systems, development and testing of new integrated cooling solutions, reliability studies of semiconductor devices using thermal transient measurement and structure function analysis.

Recent results:

• Development of a thermal reliability test method for power semiconductors using structure functions recorded during power cycling
• Development of a method for measuring the thermal conductivity of thermal interface materials
• Novel thermal measurements of power semiconductors (e.g. IGBTs)
• Development of methods for real thermal resistance measurements of LED packages, compact thermal modelling, development of relevant JEDEC measurement standards
• Development and characterisation of microchannel integrated cooling solutions by thermal transient measurements and numerical simulations
• Development of log-thermal simulation methods to investigate the thermal properties of digital integrated circuits at different levels of circuit abstraction (cell, RTL, system)
• Development of finite volume numerical simulation algorithms, development of ROM algorithms for thermal simulations
• Modelling and characterisation of MEMS devices operating on electrothermal principles
• Investigation of thermal phenomena during heterogeneous integration and development of cooling solutions

Special infrastructure:

T3Ster (classic) thermal transient tester • HV booster for T3Ster • TeraLED accessory for combined thermal and radiometric/photometric LED measurements for T3Ster, 30 cm integrating sphere (with Pletier element cold plate) • TeraLED accessory for T3Ster instrument for combined thermal and radiometric/photometric LED measurements, 50 cm integrating sphere (with Pletier element and liquid cold plate) • Julabo thermostat • WEISS climatic chamber (1-2m3)

Recent projects:

NKFIH K_20 135224 Novel solutions to thermal problems in chiplet-based System-on-Package devices • OTKA 109232 Integrated thermal management in System-on-Package devices • AI-TWILIGHT H2020 ECSEL • Delphi4LED H2020 ECSEL

International relations:

TU Chemnitz • Thales Research

Industrial partners:

Mentor, UK • Infineon • HungaroLux Light Kft

Microelectronics reliability and failure analysis

Activity of the research group:

The research group deals with quality, reliability problems and physical failure mechanisms of electronic products and components. The strengths of the research group are that its staff have a strong foundation in electronics manufacturing technology, requiring interdisciplinary knowledge, and that they are researching topics that will determine industrial interest in the long term. The results achieved by the research group are directly applicable to the practice of the electronics manufacturing industry.

Recent results:

Research into the reliability of electronic products is a constant focus for the manufacturing industry. The research group has made progress in understanding the failure mechanisms (e.g. electrochemical migration, whisker formation) that occur during the operation of products over the longer term, and in developing materials science methods for the analysis of products.

Special infrastructure:

FEI Inspect S50 scanning electron microscope • SONIX HS1000 scanning acoustic microscope • Bruker Tensor II infrared spectroscope • Spectro Midex M X-ray fluorescence spectrometer • Dage XD6600 X-ray microscope • Espec and Weiss climate chambers • Coherent AVIA 355 laser micromachining • Epilog Mini 30W laser micromachining • Voltalab PGZ301 dynamic EIS and voltmeter

Recent projects:

OTKA projects

International relations:

Technical University of Denmark • Southwest Petroleum University • King Mongkut’s University of Technology North Bangkok

Industrial partners:

METALLOGLOBUS FÉMÖNTŐ KFT. • EFI • MFA

Chip-sized laboratories

Activity of the research group:

The Lab-on-a-Chip devices research group deals with multiple, partly overlapping topics. The overlapping area is referred as flow chemistry. Unlike batch chemistry, flow chemistry is easier to automate, process based and better scalable.

Area of interest:

• Industrual IoT based control of Pharma 4.0 flow chemistry modules and instruments (in industrial cooperation)
• Development of flow microreactors: as the core of the flow chemistry system, this device consists of biocatalisator molecules in immobilized form. PDMS and 3D printed technologies (with BME SzKTT, University of Ljubljana)
• Open Microfluidics platform: R&D oriented, open hardware and software platform for microlfuidics systems (with the Taltech University)
• Nanocarrier technology: development and construction of primarily polymer nanofibers, heterogeneous integration to microreactors (in industrial cooperation)
• Numerical investigation of the mechanical behaviour of magnetic nanoparticles in microfluidics environment (with BME SzKTT, University of Ljubljana)

Recent results:

• Participation in the CPS4EU project
• Cooperations with Spinsplit
• Successful simulation and validation measurements to describe the aggregation of magnetic nanoparticles in an external magnetic field under different fluid flow conditions

Special infrastructure:

Spinsplit spFlow flow chemistry system • Spinsplit spinCube nanofiber formation equipment • CraftUnique CraftBot FDM 3D printer • Prusa i3 MK3S FDM 3D printer • Prusa SL1 SLA 3D printer

Recent projects:

EURIIDICE • CELSA21 • CPS4EU • DigiFED • OTKA

International relations:

Taltech University • University of Ljulblajna • Babes-Bolyai University • University of South-Eastern Norway

Industrial partners:

Spinsplit