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Thermal management, electronics cooling and reliability

Activity of the research group:

Measurement, modelling and simulation of the thermal properties of semiconductor devices, modules and systems, development and testing of new integrated cooling solutions, reliability studies of semiconductor devices using thermal transient measurement and structure function analysis.

Recent results:

• Development of a thermal reliability test method for power semiconductors using structure functions recorded during power cycling
• Development of a method for measuring the thermal conductivity of thermal interface materials
• Novel thermal measurements of power semiconductors (e.g. IGBTs)
• Development of methods for real thermal resistance measurements of LED packages, compact thermal modelling, development of relevant JEDEC measurement standards
• Development and characterisation of microchannel integrated cooling solutions by thermal transient measurements and numerical simulations
• Development of log-thermal simulation methods to investigate the thermal properties of digital integrated circuits at different levels of circuit abstraction (cell, RTL, system)
• Development of finite volume numerical simulation algorithms, development of ROM algorithms for thermal simulations
• Modelling and characterisation of MEMS devices operating on electrothermal principles
• Investigation of thermal phenomena during heterogeneous integration and development of cooling solutions

Special infrastructure:

T3Ster (classic) thermal transient tester • HV booster for T3Ster • TeraLED accessory for combined thermal and radiometric/photometric LED measurements for T3Ster, 30 cm integrating sphere (with Pletier element cold plate) • TeraLED accessory for T3Ster instrument for combined thermal and radiometric/photometric LED measurements, 50 cm integrating sphere (with Pletier element and liquid cold plate) • Julabo thermostat • WEISS climatic chamber (1-2m3)

Recent projects:

NKFIH K_20 135224 Novel solutions to thermal problems in chiplet-based System-on-Package devices • OTKA 109232 Integrated thermal management in System-on-Package devices • AI-TWILIGHT H2020 ECSEL • Delphi4LED H2020 ECSEL

International relations:

TU Chemnitz • Thales Research

Industrial partners:

Mentor, UK • Infineon • HungaroLux Light Kft